Traditional no-wash TF-800T series
TF-800T is W/W grade rosin imported from the United States. It is compounded through a special activation process to form a no-clean, low-solids electronic flux. The board after welding is transparent and clean, and has the characteristics of quick drying and non-stickiness. It meets the requirements The U.S. military specifies MIL-14256 and the U.S. federal QQ-S-571E standard.
TF-800T is W/W grade rosin imported from the United States. It is compounded through a special activation process to form a no-clean, low-solids electronic flux. The board after welding is transparent and clean, and has the characteristics of quick drying and non-stickiness. It meets the requirements The U.S. military specifies MIL-14256 and the U.S. federal QQ-S-571E standard.
For the two standards of MIL-14256 and QQ-S-517E, although there is no limit on the active dose used, for some special products and relevant national regulations: PCB boards do not contain conductive ions and corrosive ions, and comply with the latest environmental protection requirements. At the same time, long-term stable quality can be maintained before and after welding. TF-800T meets this requirement.
Product Features
High insulation resistance
The substrate and parts will not be corrosive after welding or during high-temperature operations after welding. The
residue on the board is hard and transparent, and does not absorb water. No need to
clean
. Can pass strict copper mirror and surface impedance tests.
This product complies with Chinese standards. GB-9491-2002 standard, J-STD-004 standard
Specifications
Low solids no-clean flux TF-800●TF-800T specification sheet (Ｗ/Ｗpolar rosin)
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project |
Specifications/SPECS |
Reference standards/STANDARD |
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Flux type |
TF-800T |
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Flux category |
Low solids, no-wash |
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|
Rosin classification |
W/W extremely rosin |
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|
Solder joint color |
Bright type |
JIS-Z-3197 |
|
Solid content% |
7% |
JIS-Z-3283 JIS-Z-3197 |
|
Exterior |
Light yellow liquid |
|
|
proportion |
0.808±0.01 |
|
|
Diffusion rate % |
82% |
IPC-TM-650 2.4.46 |
|
Insulation resistanceΩ |
≥1×109 |
JIS-Z-3197 |
|
Water extract resistivity (ΩCM ) |
≥5×104 |
JIS-Z-3197 |
|
residual corrosion |
no corrosion |
IPC-TM-650 2.6.15 |
|
Thinner type |
TF-210 |
|
Parameters
Low solid no-clean flux TF-800 recommended parameter table
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TF-800T |
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How to operate |
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Flux Coating Amount Solid Content |
spray method |
400-750mg/in 2 |
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foaming method |
450-750mg/in 2 |
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Board preheating temperature (°C ) |
Single panel: 60-100 |
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Bottom preheating temperature (°C ) |
Single panel: 85-110 |
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Surface heating rate |
Below 2°C per second |
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chain speed |
1.2-1.5m/min |
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chain angle |
4.0±0.5 |
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Soldering time |
3-6 seconds (this data is for reference only, please refer to the actual process for actual production ) . |
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Tin temperature (℃ ) |
245±5 |
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