Lead-free no-clean TF-9000 series

TF-9000 series is W/W grade modified high-quality rosin imported from the United States. It is compounded through a special activation process to form a no-clean, low-solid, weakly active electronic flux. The board after welding is transparent and clean, and has a quick-drying effect. Non-sticky properties.

Product Introduction
TF-9000 series is a W/W grade modified high-quality rosin imported from the United States. It is compounded through a special activation process to form a no-clean, low-solid, weakly active electronic flux. After welding, the board is transparent and clean, and has Quick-drying and non-sticky properties.
For the two standards of MIL-14256 and IPC-TM-650, although there is no limit on the active dose used, for some special products and relevant national regulations, PC boards do not contain conductive ions and corrosive ions. Complying with the latest environmental protection requirements, while maintaining long-term stable quality before and after welding, the TF-9000 series meets this requirement.
 
Product Features
High insulation resistance value, no cleaning.
There will be no corrosion to the substrate and parts during high-temperature operations before and after welding.
Leaves very little residue, spreads evenly, dries quickly and does not absorb water.
The solder joints are full, the tin is uniform, and the tin penetration is excellent.
It can pass strict copper mirror and surface impedance tests.
It has good wetting power and can effectively reduce the surface tension of solder.  
 
Scope of application
: Welding of PCB boards in electronic industries such as computer motherboards, communication equipment, televisions, audio equipment, household appliances, instruments and equipment, medical equipment, UPS, etc.

Specifications Lead-free no-clean flux TF-9000●TF-9000-1●TF-9000-5B●TF-9000-5 specification sheet 

Recommended parameters Lead
-free no-clean flux TF-9000 TF-9000-1 TF-9000-5B TF-9000-5 recommended parameter table